This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.
| ISBN: | 9783662488218 |
| Publication date: | 16th November 2015 |
| Author: | Qingke Zhang |
| Publisher: | Springer an imprint of Springer Berlin Heidelberg |
| Format: | Hardback |
| Pagination: | 143 pages |
| Series: | Springer Theses |
| Genres: |
Engineering: Mechanics of solids Testing of materials Classical mechanics Materials science |
This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-Free Solder Joint Interfaces features in the following genres: Engineering: Mechanics of solids, Testing of materials, Classical mechanics, Materials science
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-Free Solder Joint Interfaces is available in Hardback
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-Free Solder Joint Interfaces was written by Qingke Zhang and published by Springer an imprint of Springer Berlin Heidelberg
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-Free Solder Joint Interfaces has 143 pages
Yes it is part of Springer Theses series