Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic.
| ISBN: | 9780081020944 |
| Publication date: | 30th May 2018 |
| Author: | Katsuaki The Institute of Scientific and Industrial Research, Osaka University, Japan Suganuma |
| Publisher: | Woodhead Publishing Ltd an imprint of Elsevier Science & Technology |
| Format: | Paperback |
| Pagination: | 240 pages |
| Series: | Woodhead Publishing Series in Electronic and Optical Materials |
| Genres: |
Materials science Electronics and communications engineering Electronic devices and materials Electronics engineering |
Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic.
Wide Bandgap Power Semiconductor Packaging features in the following genres: Materials science, Electronics and communications engineering, Electronic devices and materials, Electronics engineering
Wide Bandgap Power Semiconductor Packaging is available in Paperback
Wide Bandgap Power Semiconductor Packaging was written by Katsuaki The Institute of Scientific and Industrial Research, Osaka University, Japan Suganuma and published by Woodhead Publishing Ltd an imprint of Elsevier Science & Technology
Wide Bandgap Power Semiconductor Packaging has 240 pages
Yes it is part of Woodhead Publishing Series in Electronic and Optical Materials series