Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.
| ISBN: | 9781441922847 |
| Publication date: | 19th November 2010 |
| Author: | K N Tu |
| Publisher: | Springer an imprint of Springer New York |
| Format: | Paperback |
| Pagination: | 370 pages |
| Series: | Springer Series in Materials Science |
| Genres: |
Materials science Electronics: circuits and components Security and fire alarm systems Production and industrial engineering Electronics engineering |
Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006.
Solder Joint Technology features in the following genres: Materials science, Electronics: circuits and components, Security and fire alarm systems, Production and industrial engineering, Electronics engineering
Paperback, Hardback. Not Available.
Solder Joint Technology was written by K N Tu and published by Springer an imprint of Springer New York
Solder Joint Technology has 370 pages
Yes it is part of Springer Series in Materials Science series