Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
| ISBN: | 9780081025321 |
| Publication date: | 15th November 2019 |
| Author: | Hengyun Shanghai University of Engineering Science, China Zhang, Faxing Institute of Microelectronics IME, Agency for Che |
| Publisher: | Woodhead Publishing Ltd an imprint of Elsevier Science & Technology |
| Format: | Paperback |
| Pagination: | 434 pages |
| Series: | Woodhead Publishing Series in Electronic and Optical Materials |
| Genres: |
Electronics engineering Materials science |
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore features in the following genres: Electronics engineering, Materials science
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore is available in Paperback
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore was written by Hengyun Shanghai University of Engineering Science, China Zhang, Faxing Institute of Microelectronics IME, Agency for Che and published by Woodhead Publishing Ltd an imprint of Elsevier Science & Technology
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore has 434 pages
Yes it is part of Woodhead Publishing Series in Electronic and Optical Materials series