Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
| ISBN: | 9780081025321 |
| Publication date: | 15th November 2019 |
| Author: | Hengyun (Shanghai University of Engineering Science, China) Zhang, Faxing (Institute of Microelectronics (IME), Agency for Che |
| Publisher: | Woodhead Publishing Ltd an imprint of Elsevier Science & Technology |
| Format: | Paperback |
| Pagination: | 434 pages |
| Series: | Woodhead Publishing Series in Electronic and Optical Materials |
| Genres: |
Electronics engineering Materials science |