Books By Yan Li, Hualiang Shi - Author

Dr. Yan Li is currently a senior staff engineer in Corporate Quality Network of Intel Corporation located in Chandler, Arizona. Dr. Li received her Ph.D. degree in Materials Science and Engineering from Northwestern University in 2006 and her M.S and B.S degree in Physics from Peking University in 1999 and 1996, respectively. Dr. Li has been actively involved in numerous microelectronic packaging-related technical solutions and focusing on the quality and reliability of electronic packages, fundamental understanding of failure modes and failure mechanisms of electronic packages, developing new tools and techniques for fault isolation and failure analysis of advanced electronic packages. Dr. Li is a senior member and contributor of many international professional associations, such as Minerals Metals and Materials Society (TMS), American Society for Metals (ASM), and Electronic Device Failure Analysis Society (EDFAS). She has been appointed as TMS and International Symposium for Testing and Failure Analysis