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Book Series: Wspc Series In Advanced Integration And Packaging

Book Cover for Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research by Madhusudan Google, Usa Iyengar

Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research

Madhusudan Google and 1 more

Hardback

Book Cover for Cost Analysis Of Electronic Systems by Peter Univ Of Maryland, Usa Sandborn

Cost Analysis Of Electronic Systems

Peter Univ Of Maryland and 1 more

Hardback

Book Cover for Mems Packaging by Yungcheng Univ Of Colorado Boulder, Usa Lee

Yungcheng Univ Of Colorado Boulder and 1 more

Hardback

Book Cover for Solder Materials by Kwanglung Natl Cheng Kung Univ, Taiwan Lin

Solder Materials

Kwanglung Natl Cheng Kung Univ and 1 more

Hardback

Book Cover for Thermoelectric Energy Conversion Devices And Systems by Kazuaki Yazawa, Jehyeong Bahk, Ali Shakouri

Thermoelectric Energy Conversion Devices And Systems

Kazuaki Yazawa and 2 more

Hardback