This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages.
Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
| ISBN: | 9789811570926 |
| Publication date: | 24th November 2021 |
| Author: | Yan Li, Deepak Goyal |
| Publisher: | Springer an imprint of Springer Nature Singapore |
| Format: | Paperback |
| Pagination: | 622 pages |
| Series: | Springer Series in Advanced Microelectronics |
| Genres: |
Electronics: circuits and components Engineering applications of electronic, magnetic, optical materials Electronics engineering Materials science |
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages.
3D Microelectronic Packaging features in the following genres: Electronics: circuits and components, Engineering applications of electronic, magnetic, optical materials, Electronics engineering, Materials science
Paperback, Hardback. £143.99, down from the £159.99 cover price. Not Available.
3D Microelectronic Packaging was written by Yan Li, Deepak Goyal and published by Springer an imprint of Springer Nature Singapore
3D Microelectronic Packaging has 622 pages
Yes it is part of Springer Series in Advanced Microelectronics series
£143.99, reduced from £159.99. Not Available.