This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages.
Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
| ISBN: | 9783319445847 |
| Publication date: | 1st February 2017 |
| Author: | Yan Li, Deepak Goyal |
| Publisher: | Springer an imprint of Springer International Publishing |
| Format: | Hardback |
| Pagination: | 463 pages |
| Series: | Springer Series in Advanced Microelectronics |
| Genres: |
Electronics engineering Electronics: circuits and components Electronic devices and materials Metals technology / metallurgy Industrial chemistry and chemical engineering Other manufacturing technologies |
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages.
3D Microelectronic Packaging features in the following genres: Electronics engineering, Electronics: circuits and components, Electronic devices and materials, Metals technology / metallurgy, Industrial chemistry and chemical engineering, Other manufacturing technologies
Paperback, Hardback. Not Available.
3D Microelectronic Packaging was written by Yan Li, Deepak Goyal and published by Springer an imprint of Springer International Publishing
3D Microelectronic Packaging has 463 pages
Yes it is part of Springer Series in Advanced Microelectronics series