Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
| ISBN: | 9781845695286 |
| Publication date: | 22nd May 2015 |
| Author: | EH Wong, YW University Chair and Professor of Mechanical Engineering at the University of Sydney, Australia Mai |
| Publisher: | Woodhead Publishing Ltd an imprint of Elsevier Science & Technology |
| Format: | Hardback |
| Pagination: | 482 pages |
| Series: | Woodhead Publishing Series in Electronic and Optical Materials |
| Genres: |
Mechanical engineering Electronic devices and materials Electronics engineering Engineering: Mechanics of solids |