Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author's personal experience.
| ISBN: | 9781402045783 |
| Publication date: | 13th June 2006 |
| Author: | J A Dziuban |
| Publisher: | Springer an imprint of Springer Netherlands |
| Format: | Hardback |
| Pagination: | 331 pages |
| Series: | Springer Series in Advanced Microelectronics |
| Genres: |
Engineering: Mechanics of solids Engineering applications of electronic, magnetic, optical materials Production and industrial engineering Electronics engineering Engineering: general |
Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown.
Bonding in Microsystem Technology features in the following genres: Engineering: Mechanics of solids, Engineering applications of electronic, magnetic, optical materials, Production and industrial engineering, Electronics engineering, Engineering: general
Hardback. Not Available.
Bonding in Microsystem Technology was written by J A Dziuban and published by Springer an imprint of Springer Netherlands
Bonding in Microsystem Technology has 331 pages
Yes it is part of Springer Series in Advanced Microelectronics series